Integration of RF passive components into semiconducting device through 3D capacitive coupling for application to fully-integrated MMIC
نویسندگان
چکیده
In this work, a 3D capacitive coupling structure employing periodic pattern was used for application to miniaturized on-chip passive components on MMIC (Monolithic Microwave Integrated Circuit). Unlike conventional periodic structure, the characteristic impedance of the 3D capacitive coupling structure was hardly dependent on frequency. Using the 3D capacitive coupling structure, RF passive component was highly miniaturized in comparison with conventional one.
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